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Advanced Copper-Polyimide Composite Structured Substrate

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Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

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Advanced Copper-Polyimide Composite Structured Substrate

Name: Advanced CopperPolyimide Composite Structured Substrate
Brand: Guofeng
Price: 300 USD

Best Advanced Copper-Polyimide Composite Structured Substrate wholesale

Brand Name : Guofeng

Model Number : 25um

Certification : SGS Reach ROHS

Place of Origin : China

MOQ : 150kg

Payment Terms : L/C,T/T

Delivery Time : 7 Working Days

Packaging Details : Standard Packing

Price : $300-$30000

Supply Ability : Negotiation

Cladding Material : Copper

Surface Treatment : Chemical Etching

Material : Polyimide

Adhesive Type : Acrylic

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Advanced Copper-Polyimide Composite Structured Substrate

Product Overview:

The GL series represents a significant advancement in polyimide film technology. Utilizing our proprietary biaxial stretching process, we engineer a molecularly oriented structure that delivers a consistent 30% enhancement in key properties—including tensile strength, dimensional stability, and chemical resistance—compared to standard alternatives. This high-performance, natural yellow polyimide film is available in customized thicknesses and is the preferred material for demanding applications such as adhesive substrates and advanced chip packaging.

Place of Origin:

ANHUI, CHINA

Material:

Polyimide

Color:

Yellow

Treatment:

Single-side / Both Sides

Width:

514MM, 520MM, 1028MM, 1040MM

Thickness:

custom

Packaging:

vacuum packaging

Supply Ability:

2000 ton/year

Product Features:

Outstanding Mechanical Strength

Exceptional Dimensional Stability

Superior Laminating Properties

Conforms to RoHS and REACH regulations.

Product Applications:

The GL high-performance polyimide film is primarily used in:

High-precision adhesive FCCL substrates

High-stability cover films

Chip packaging

Special adhesive tape substrates

Handling & Storage Instructions:

To ensure the longevity and performance of our Polyimide film:

Shelf Life: 6 months from the date of manufacture
Storage Conditions:
- Store in a cool, dry place away from direct sunlight
- Avoid exposure to high humidity or extreme temperature fluctuations

Product Images:

Advanced Copper-Polyimide Composite Structured Substrate

Company Image:

Advanced Copper-Polyimide Composite Structured Substrate

Polyimide film

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